Dimensioning of Relief Devices

Donat, C., Selecting and Dimensioning of Pressure Relief Devices for Dust Explosions, Staub-Reinhaltung der Luft, 31, No. 4, 1971, pp. 17-25. 

The design of the most advanced microelectronic devices now requires with sub-half micron dimensions. Photo, electron beam and x-ray lithographies are all candidates for patterning at such resolution. Resist resolution, along with relief image wall profiles and contrast must be improved and controlled in order for the fabrication of such devices to become practical. 

Table 7.1 Dimensions of the relief devices for the different cases examined...

Although the lower relief pressure does not lead to different sizing of the relief device to be selected in the present case it is obvious that this might occur, since the minimum cross section is larger than with the higher rehef pressure. For this reason there is an industrial practice to deviate from the standard and to choose the set pressure as the basis for dimensioning. 

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