D Copper and Tin Electro-Deposits

Shown in Fig. 4 are some typical copper electro-deposits created by the competitive process of copper deposition and hydrogen evolution under the application of a cathodic current density of 3 A cm in the electrolyte solution of 1 M sulfuric acid + 0.5 M copper sulfate. The resulting electro-deposits are characterized 

The created foam stmcture retains its integrity during the deposition and the subsequent processes such as drying and structural 

It is important to note that very few large branches are observed throughout the stmcture, as evident from a cross-sectional view shown in Fig. 5. The absence of over-grown large branches could be explained as follows  

Nevertheless, there are following two subtle differences between copper and tin electro-deposits. 

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