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Cure analysis

A. Mank, E. Verstegen and H. Kloosterboer, In-situ curing analysis of photoreplicated objective lenses using Raman and IR spectroscopy, J. Appl. Polym. ScL, 99, 1287-1295 (2006). [Pg.240]

J.C. Cruz, T.A. Osswald and M. Kemper, Rrecise curing analysis of accelerated unsaturated polyester reactions under Raman spectroscopy. Proceedings, 64th Annual Technical Conference - Society of Plastics Engineers (ANTEC), Charlotte, NC, USA, May 7-11, 2006, Society of Plastics Engineers, Brookfield, CT, 2828-2832. [Pg.240]

Cure Rate of the Phenolated SEL Resins. 13C NMR spectra of the phenolated SEL formaldehyde-treated resins revealed the formation of methylol groups. A similar cure reaction to resole type phenolic resins is expected to occur with the phenolated lignin-based resins. Since cure rate normally determines production capacity of a board mill, it is important that new types of adhesives have at least the same cure rate as the conventional phenolic adhesives. Cure analysis of resins has usually been examined by... [Pg.342]

Figure 8 shows the temperature dependencies of e" at four frequencies for Epikote 1001 (M w=1396) in comparison with that of a/E0 calculated from the data by the DC conduction measurements [10]. A broad peak is observed for each of the four frequencies at low temperatures on the plot of e", which is due to the rotational diffusion of the dipole moments. A good agreement is observed between e" (plots) and o/E0 (a solid curve) at higher temperatures and at lower frequencies in Fig. 8. The dielectric loss e" can be used as an indicator of the ionic conduction in the DGEBA oligomer at a fixed frequency at the temperatures where the dipole component is negligible. The ionic conduction from the dielectric loss can be measured in a short period of time and is widely used for the cure analysis of epoxy resin systems [62,79-82]. Figure 8 shows the temperature dependencies of e" at four frequencies for Epikote 1001 (M w=1396) in comparison with that of a/E0 calculated from the data by the DC conduction measurements [10]. A broad peak is observed for each of the four frequencies at low temperatures on the plot of e", which is due to the rotational diffusion of the dipole moments. A good agreement is observed between e" (plots) and o/E0 (a solid curve) at higher temperatures and at lower frequencies in Fig. 8. The dielectric loss e" can be used as an indicator of the ionic conduction in the DGEBA oligomer at a fixed frequency at the temperatures where the dipole component is negligible. The ionic conduction from the dielectric loss can be measured in a short period of time and is widely used for the cure analysis of epoxy resin systems [62,79-82].
Key words compression molding, sheet molding compound, mold design, flow and cure analysis, fiber orientation and separation. [Pg.47]

Liu, X. L. and Hillier, W. (1999), Heat transfer and cure analysis for the pultrusion of a fiberglass-vinyl esterlbeam , 10th International Corferenceon Composite Structures, Melbourne, Australia. [Pg.411]

Cure analysis of thermoset thin films by ETIR emission has also been reported [500]. FTIES was used to smdy cure monitoring of aerospace epoxy resins and prepregs and provides a rapid method for prepreg quality acceptance [501]. Also curing of commercial polyurethane two-component paints has been carried out by FUR emission [493]. [Pg.75]

J.F. Sprouse, B.M. Halpin, Jr., and R.E. Sacher, "Cure Analysis of Epoxy Composites Using Fourier Transform Infrared Spectroscopy", (AMMRC TR 78-45), Army Materials and Mechanics Research Center, Watertown, MA 02172 (DRXMR-RA). [Pg.78]


See other pages where Cure analysis is mentioned: [Pg.269]    [Pg.283]    [Pg.299]    [Pg.149]    [Pg.180]    [Pg.181]    [Pg.183]    [Pg.185]    [Pg.210]    [Pg.237]    [Pg.184]    [Pg.47]    [Pg.74]    [Pg.34]    [Pg.51]    [Pg.207]    [Pg.1997]    [Pg.1999]   
See also in sourсe #XX -- [ Pg.16 , Pg.319 ]




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