Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Cu substrates

Carbon dioxide has been proposed as an additive to improve the performance of lithium batteries [60]. Aurbach et al. [61] studied the film formed on lithium in electrolytes saturated with C02, and using in situ FTIR found that Li2C03 is a major surface species. This means that the formation of a stable Li2C03 film on the lithium surface may improve cyclability [62], Osaka and co-workers [63] also studied the dependence of the lithium efficiency on the plating substrate in LiC104-PC. The addition of C02 resulted in an increase in the efficiency when the substrate was Ni or Ti, but no effect was observed with Ag or Cu substrates. [Pg.349]

Some Cu substrates have been used, including Cu foils, etched foils, and vapor deposited Cu on glass. There does not appear to be a significant difference in the quality of deposits formed on Cu vs. Au, beyond those expected from considerations of lattice matching. [Pg.14]

Fig. 33. XRD pattern of the [111] peak for zinc blende InSb, formed with 200 cycles on a Cu substrate. This figure was adapted from ref. [280],... Fig. 33. XRD pattern of the [111] peak for zinc blende InSb, formed with 200 cycles on a Cu substrate. This figure was adapted from ref. [280],...
Figure 5.20 (a) Scheme of generation of mixed lines A-B and C-D crossing a nanopore and a SAMs and nanopores using UPD of Ag and Cu. substrate step. Reproduced with permission (b) STM image of a sample prepared by the from Ref. [220]. sequence of steps i-v. (c) height profiles with... [Pg.236]

In industrial applications of metal deposition a metal M is deposited either on the native metal substrate M or on a foreign metal substrate S. As an example of the former, Cu is electrodeposited on a Cu substrate formed by electroless Cu deposition on an activated nonconductor in the fabrication of printed circuit boards. As an example of the latter, Ni is electrodeposited on Cu in the fabrication of contact pads in the electronics industry. [Pg.131]

Let us determine whether we can use the displacement deposition technique to deposit Sn on a Cu substrate. The simplest way to determine this is to use the principle presented in Figures 5.10 and 9.1. According to this principle, Sn cannot be deposited by displacement on a Cu substrate since the standard electrode potential of a Cu /Cu couple is more positive than that of an Sn +/Sn couple ... [Pg.172]

A strong tendency for the multilayered coating to adopt a 111 texture. Actually, an extended one-dimensional coherent 111 texture develops even on initially non-[l 1 l]-oriented Cu substrate. [Pg.292]

Adsorption of saturated hydrocarbons on a Cu substrate provides a good model system for investigating the electronic structure since the rf-band interaction appears entirely in the occupied states, making the effects more clearly visible and the analysis of the electronic structure easier. There is an advantage to use the (110) surface with a two-fold symmetry if the molecule adsorbs with preferential alignment allowing projection of the electronic structure in three directions as discussed in the previous sections. [Pg.120]

Figure 19. Transmission spectrum for benzene physisorbed on a Cu substrate ... Figure 19. Transmission spectrum for benzene physisorbed on a Cu substrate ...
Fig. 35. Thickness and composition of the Cu substrate surface, the inner oxide and the outer hydroxide of passive layers on Cu50Ni formed in phthalate buffer pH 5.0 for 300 s as a function of the electrode potential with distinction of the hydroxide and oxide species with different valences [82]. Fig. 35. Thickness and composition of the Cu substrate surface, the inner oxide and the outer hydroxide of passive layers on Cu50Ni formed in phthalate buffer pH 5.0 for 300 s as a function of the electrode potential with distinction of the hydroxide and oxide species with different valences [82].
Fassaert et al. (68) simulated H adsorption on a Cu surface by adding an additional electron per metal atom to the system. This approximation relies on the fact that atomic wave functions and energy levels are not too different for Ni and Cu and that their principal difference lies in the number of valence electrons. In the case of adsorption to Cu substrate, which has no unfilled d orbitals, the metal d orbitals do not participate in the bonding to H. All bonding takes place using the metal 4s orbitals. The calculated covalent bond energy is comparable on the Ni and Cu substrate models, so that from the results a distinction between the catalytic properties of the two metals cannot be made. [Pg.48]

Figure 24 AFM images of a Cu substrate on which Li was deposited and then dissolved in PC/LiC104 solution (a,b). Note the nonuniform Li deposition in this solution, and the fact that dead Li remains after the dissolution step. The image in (b) reflects the porous structure of the surface films [109]. (With copyrights from The Electrochemical Society Inc., 1998.)... Figure 24 AFM images of a Cu substrate on which Li was deposited and then dissolved in PC/LiC104 solution (a,b). Note the nonuniform Li deposition in this solution, and the fact that dead Li remains after the dissolution step. The image in (b) reflects the porous structure of the surface films [109]. (With copyrights from The Electrochemical Society Inc., 1998.)...

See other pages where Cu substrates is mentioned: [Pg.308]    [Pg.182]    [Pg.183]    [Pg.183]    [Pg.163]    [Pg.12]    [Pg.87]    [Pg.182]    [Pg.202]    [Pg.53]    [Pg.72]    [Pg.503]    [Pg.504]    [Pg.241]    [Pg.143]    [Pg.172]    [Pg.174]    [Pg.106]    [Pg.31]    [Pg.123]    [Pg.271]    [Pg.137]    [Pg.164]    [Pg.1583]    [Pg.50]    [Pg.201]    [Pg.275]    [Pg.65]    [Pg.136]    [Pg.143]    [Pg.358]    [Pg.365]    [Pg.30]    [Pg.357]   
See also in sourсe #XX -- [ Pg.52 ]

See also in sourсe #XX -- [ Pg.182 ]




SEARCH



Step of Substrate to Polymer-Cu Catalysts

Thin Evaporated Metal Substrates Al, Cu, Au, Mg

© 2024 chempedia.info