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Copper with organic solderability preservative

No-clean solder pastes can solder most popular metal finishes adequately due to improvements in the activator packages. Gold over nickel, bare copper with organic surface preservatives, silver immersion, tin plates, and hot-air leveled boards are popular, while component terminations such as tin, tin/lead, silver, silver palladium, and nickel are used. Solder pastes can be designed to solder specific surfaces and maintain the non-corrosive and electrical resistance required to qualify them as no-clean pastes. [Pg.15]

See other pages where Copper with organic solderability preservative is mentioned: [Pg.302]    [Pg.304]    [Pg.1048]    [Pg.16]    [Pg.88]    [Pg.442]    [Pg.700]    [Pg.998]    [Pg.5871]    [Pg.241]    [Pg.5186]    [Pg.5185]    [Pg.752]   
See also in sourсe #XX -- [ Pg.700 ]



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