Copper scanning electron micrograph

Figure 5.2 Micrographs of metal-coated lipid tubules. Top panel shows scanning electron micrograph of copper-plated microtubules (bar = 2.0 (Jim), while bottom panel shows optical micrograph of iron-coated microtubules embedded in acrylic-urethane clear coating (bar = 25 p,m). Reprinted from Ref. 135 with permission of Wiley-VCH.

Figure 5.27 Scanning electron micrograph of copper-coated DCg PC (38) tubules. Tubules are hollow with diameter of approximately 0.5 p.m (bar = 0.5 p,m). Helical wrappings evident in some tubules are all right handed. Reprinted with permission from Ref. 125. Copyright 1998 by the American Chemical Society. 

Fig. 3. Scanning electron micrograph of copper used in methanol synthesis study (40). [Reprinted with permission from J. Catal. 57, 339 (1979). Copyright (1979) Academic Press, New York.]...

Figure 1. Scanning electron micrographs of Kapton polyimide (a) as-received, (b) seeded with copper, (c) after 450°C heat treatment, and (d) after heat treatment and removal of all copper oxide.

Figure 13. Scanning electron micrograph of tubules and helices formed from DCe.gPC (26, m=8, n = 9) at 50% 2-propanol in water that were subsequently coated with copper metal. Note that all helical structures are right-handed and that the pitch of the helices is somewhat variable. Bar, 2.48 pm. Reproduced from ref. 158 (Georger et al., J. Am. Chem. Soc. 1987, 109,6169) with permission of the American Chemical Society.

FIG. 8 Scanning electron micrograph and profiles of etching pits on a thin copper layer. The etching pits were formed as a result of leaving a 25 /xm diameter Pt UME (biased at 0.7 V vs. SCE) close above (9 gm) the surface for 5, 10, and 20 minutes. (From Ref. 24.)... 

Fig. 1.10 Copper pitting corrosion in drinking water system (a) stereomicrography of perforated membrane and (b) scanning electron micrograph of perforated pit [28].

Scanning electron micrograph of a copper doped polyimide film (a) prior to, and (b) following post-processing. 

Fig. 10.6. Here scanning electron micrograph of a machined microfeature suitable for MEMS applications is shown in which a platinum wire of 10 (xm diameter was used as a tool on the copper sheet upon the application of 2 MHz frequency of 50-ns, 1.6-V pulses. To obtain a delicate 3-D copper microstructure, i.e., 5 xm x 10 (un x 12 (xm in the middle of the square pocket sitting on a base, i.e., 15 xm X 15 (xm x 10 xm, the microtool is first fed vertically 12 (xm deep into the workpiece. After this vertical machining, the microtool is moved laterally along the prescribed path in the copper sheet. The outer rectangular trough is dissolved to a dimension of 22 (xm x 14 (xm. During the process, the microtool feed rate is adjusted to 0.5 xm by monitoring the peak current transient of the inter-electrode gap [3].

Figure 2. The Scanning Electron Micrographs of copper on (a) GaAs (110) and (b) patterned deposition using 20 pm x 20 pm grid on SI (111).

Figure 8. Scanning electron micrograph of Teflon after (1) chemical etching, (2) excimer laser removal of selective etched areas, and (3) Cu-CVD. Copper extends along the left edge of the photograph, and the broad line extending to the right.

Figure 2. Scanning electron micrograph (top) and optical cross section (bottom) of an Ultem 1000 film pretreated according to the Standard 2312 process and metallized on one side with copper.

Fig. 1. Scanning electron micrographs of microflbrous oxides on (a) copper and (b) steel...

Figure 334 Scanning electron micrograph of polycrystalline copper surface after anodic attack.

Figure 7.24 Scanning electron micrographs of the surface of a duplex stainless steel after immersion in 10% HCl for 2 h showing selective attack of constituent phases (a). The micrograph (b) shows the same alloy after immersion in 0.1 M CUSO4. One observes selective deposition of copper on the more cathodic austenite phase [5].

Figure 16.1.9 Scanning electron micrographs of copper nanowires. These nanowires were electrodeposited from the solution indicated in Table 16.1.1, using = -800 mV f g and = —5 mVjQg. The growth times employed in each experiment were (a) 120 sec, (b) 180 sec, (c) 300 sec, (d) 600 sec, (e) 900 sec, and (f) 2700 sec. Reprinted with permission of the American Chemical Society.

Fig. 3.13 Images of halloysite clay, (a) Transmission election micrograph of tubes dispersed in water and dried on a copper grid (b) Scanning electron micrograph of dry HNT powder (Wei et al. 2014) Reproduced with permission of The Royal Society of Chemistry ]...

Fig. 1.25. A scanning electron micrograph of the as-polished damascene copper interconnections, approximately 0.25 fxm in cross section. The copper lines appear as the white regions in the figure. Reproduced with permission from Misawa et al.

Figures 5.29. Scanning electron micrograph of surface of a non-graphitizable carbon from PFA, HTT 1123 K, with a copper content of Cu C of 1 4500, oxidized in carbon dioxide at 873 K to 9 wt% bum-off.

Fig. 8.6 Scanning electron micrographs of a copper electrodeposit from an acid sulphate solution at various times, illustrating the development of nodular growth at the limiting current. Nominal deposit thicknesses are as follows, (a) 10 pm. (b) 15 pm. (c) 20 pm. (d) 30piti. (0.07 molditi CuSO 1 mol dm H SO 22 C and with a rotating-cyLinder cathode.) (Courtesy Dr D. R. Gabe Loughborough University of Technology.)...

Figure 1 Scanning electron micrograph of atomized copper powder.

Figure 7 Scanning electron micrograph showing the size range distribution of the leaf-like copper basic sulphate crystals formed by forced hydrolysis of copper sulphate solutions at 373K...

Figure 2 Scanning electron micrographs of copper oxide particles showing (a) the star-like target form and (b) the larger dendritic material formed simultaneously with the star-like crystals...

Figure 10 Scanning electron micrographs of CQG copper powders having various mixed morphologies...

Fig. 4 Scanning electron micrograph showing surface damage by chip for-mation, plastic deformation, and pickup of fragments of a ceramic particle abrading a copper surface...

Figure 3.3 (a) Scanning electron micrograph of the surface of copper oxidized at 90... 

Figure 3.4 Scanning electron micrographs of the fracture surface of polyethylene/ copper joints showing the polyethylene remaining on (a) a smooth, chemically polished copper substrate, (b) a micro-fibrous copper substrate [24]. 

---