Copper foil Profile

Copper foil profile is important for etching of fine-line circuits. Figures 7.23 through 7.26 illustrate the difference between standard- and low-profile foils. As can be seen in those photos. 

One important conclusion from the works on the construction of the cell is that the material (SL-20) can be described as one having excellent process properties. By this, one should among others understand perfect adhesion to the copper foil and the ability to form smooth and uniform layers. The discharge capacities for the first ten cycles are presented in the Figure 3, together with the discharge profile for the first cycle. 

One obvious method to increase printed circuit functionality is to put more circuitry per unit area of the circuit. Printed circuit densification has driven several improvements in copper foil technology. One of the first developments was high temperature elongation (HTE) foils. Other advances include low- and very-low-profile foils, thin foils, and foils for high-performance resin systems. 

Three classifications describe the profile of the copper foil surface as shown in Table 9.1. 

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