Conducting layers for printed wiring board manufacture

5 Conducting layers for printed wiring board manufacture [Pg.562]

In the mid-1990s, a process for the direct metallization of copper through-holes in printed wiring boards (PWBs) and other multilayer structures called the Envision (a registered trademark of Enthone, Inc.) DMS-E process was developed [124-126], This process competes with the traditional chemical copper deposition procedures that employ strong complexing agents (such as ethylenediamine-lV,lV,lV, lV -tetraacetic acid) [Pg.562]

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