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Chip-on-flex

Chip-on-flex is similar to chip-on-board except that the die, chips, or CSPs are wire bonded, flip chip attached, or epoxy connected to a flexible circuit instead of to a rigid interconnect substrate such as a PWB. [Pg.24]

Li, L. Fang, T. Anisotropic conductive adhesive films for flip chip on flex packages. Proceedings of the 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Helsinki, Finland, June 2000 129-135. [Pg.765]

See other pages where Chip-on-flex is mentioned: [Pg.12]    [Pg.24]    [Pg.381]    [Pg.13]    [Pg.435]    [Pg.1778]    [Pg.866]    [Pg.14]    [Pg.437]    [Pg.1467]    [Pg.1467]    [Pg.1468]    [Pg.1542]    [Pg.1543]    [Pg.428]    [Pg.1291]    [Pg.740]    [Pg.765]   
See also in sourсe #XX -- [ Pg.24 ]

See also in sourсe #XX -- [ Pg.26 ]



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