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Chemical equilibria thermodynamics Pourbaix

The analysis of thermodynamic data obeying chemical and electrochemical equilibrium is essential in understanding the reactivity of a system to be used for deposition/synthesis of a desired phase prior to moving to experiment and/or implementing complementary kinetic analysis tools. Theoretical and (quasi-)equilibrium data can be summarized in Pourbaix (potential-pH) diagrams, which may provide a comprehensive picture of the electrochemical solution growth system in terms of variables and reaction possibilities under different conditions of pH, redox potential, and/or concentrations of dissolved and electroactive substances. [Pg.85]

A metal CMP process involves an electrochemical alteration of the metal surface and a mechanical removal of the modified film. More specifically, an oxidizer reacts with the metal surface to raise the oxidation state of the material, which may result in either the dissolution of the metal or the formation of a surface film that is more porous and can be removed more easily by the mechanical component of the process. The oxidizer, therefore, is one of the most important components of the CMP slurry. Electrochemical properties of the oxidizer and the metal involved can offer insights in terms of reaction tendency and products. For example, relative redox potentials and chemical composition of the modified surface film under thermodynamically equilibrium condition can be illustrated by a relevant Pourbaix diagram [1]. Because a CMP process rarely reaches a thermodynamically equilibrium state, many kinetic factors control the relative rates of the surface film formation and its removal. It is important to find the right balance between the formation of a modified film with the right property and the removal of such a film at the appropriate rate. [Pg.202]


See other pages where Chemical equilibria thermodynamics Pourbaix is mentioned: [Pg.64]    [Pg.276]    [Pg.27]    [Pg.278]    [Pg.194]    [Pg.1807]    [Pg.97]    [Pg.63]    [Pg.99]    [Pg.653]    [Pg.151]   
See also in sourсe #XX -- [ Pg.37 , Pg.39 ]




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