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Chemical cleaning efficiency factors

In addition to these chemical reactions described above, many physical parameters need to be considered as well in terms of post-CMP cleaning. Extensive investigations have been conducted on the correlations between post-CMP cleaning efficiency and relevant physical forces such as the van der Waals force, electrostatic force, particle adhesion, chemical adsorption, surface charge modification, and wettability. It is expected that these factors strongly influence the particle-removal capability of post-CMP cleaning solution. [Pg.478]

The chemical factor ( chem) shows the efficiency of the principal active discharge species in the chemical reaction of interest. In the process of NF3 dissociation and F-atom generation for CVD chamber cleaning, the chemical factor ( chem) shows the efficiency of the atoms in the gasification of impurities. In plasma-chemical reactions stimulated by vibrational excitation, chem can be presented as... [Pg.137]

See other pages where Chemical cleaning efficiency factors is mentioned: [Pg.226]    [Pg.149]    [Pg.464]    [Pg.255]    [Pg.160]    [Pg.341]    [Pg.385]    [Pg.327]    [Pg.2]    [Pg.462]    [Pg.162]    [Pg.341]    [Pg.45]    [Pg.77]    [Pg.37]    [Pg.141]    [Pg.172]    [Pg.184]    [Pg.20]    [Pg.136]    [Pg.531]    [Pg.20]    [Pg.331]    [Pg.31]    [Pg.172]    [Pg.498]    [Pg.184]    [Pg.451]    [Pg.7762]    [Pg.480]    [Pg.47]    [Pg.235]    [Pg.166]    [Pg.62]    [Pg.425]    [Pg.233]    [Pg.353]   
See also in sourсe #XX -- [ Pg.160 ]



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