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Ceramics high-speed grinding

Kovach, J.A., Blau, P.J., Malkin, S., Srinivasan, S., Bandyopadhyay, B., and Ziegler, K., 1993, A feasibility investigation of high speed, low damage grinding process for advanced ceramics, 5th Int. Grinding Conf, Vol. I, SME. [Pg.83]

The bond is chosen depending on the intended application the material to be removed, the required quality, and the grinding parameters (cutting speed, depth of cut, feed rate). Synthetic resin bond is commonly used for conventional grinding processes and is the most economical bond. Ceramic bond is used for thermally critical processes and high... [Pg.602]

See other pages where Ceramics high-speed grinding is mentioned: [Pg.294]    [Pg.544]    [Pg.124]    [Pg.392]    [Pg.876]    [Pg.100]    [Pg.124]    [Pg.369]    [Pg.356]    [Pg.369]    [Pg.314]    [Pg.7]    [Pg.30]    [Pg.43]    [Pg.180]    [Pg.3]    [Pg.18]    [Pg.146]    [Pg.218]    [Pg.242]    [Pg.340]    [Pg.147]    [Pg.147]    [Pg.147]    [Pg.175]    [Pg.1176]    [Pg.39]    [Pg.44]    [Pg.30]    [Pg.107]    [Pg.109]    [Pg.20]    [Pg.2127]    [Pg.286]   
See also in sourсe #XX -- [ Pg.294 ]



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