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Back side topography

Retainer ring -Back side pressure -Back side topography -Speed control -Angle control by Mg. Bi... [Pg.426]

Retainer ring controls the rebound of the pad to improve the removal rate uniformity at the wafer edge. Back side pressure means the pressure applied to the back of a wafer and improves the removal rate uniformity on the front side of the wafer. B ack side topography is a mechanism for transferring unevenness on the back of the carrier to the wafer. Speed control is a mechanism for adjusting the rotation speed of the wafer and table. The adjustment changes the relative speed that is based on Preston s law, which can improve... [Pg.426]

See other pages where Back side topography is mentioned: [Pg.332]    [Pg.758]    [Pg.20]    [Pg.109]    [Pg.227]    [Pg.92]    [Pg.82]    [Pg.266]    [Pg.150]    [Pg.176]    [Pg.82]   
See also in sourсe #XX -- [ Pg.426 , Pg.427 ]



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