Application of Patterned SAMs to Circuit Formation

Fine metal wiring can be fabricated by the selective deposition of gold, copper, nickel, etc. onto patterned SAMs on substrates of silicon or plastics like polyimide. The nickel and copper patterns on silicon substrates are shown in 

28 and 29. The circuit of the minimum line width of 300 nm was fabricated by using YUY lithography of SAMs and electroless plating, and that of the minimum line width of lOnm was done by SPNL of SAMs and electroless plating under atmospheric pressure. 

In conclusion, the nano/microstructured SAMs are possible to apply to electric circuits, nano/micromoulds, nano/microsurface modification, semi con -ductor devices, molecular devices, sensors, bio chips, etc. and are expected to be developed in various industrial fields. 

Micro/Nanolithography Using Self-Assembled Monolayers (SAMs) 

We would like to thank Professor H. Sugimura and Professor N. Saito for their valuable help in this study. This work is supported in part by the Research 

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