Analysis of Prepared Sections

Microscopic inspection of prepared sections can cover a wider analytical spectrum  

By way of example. Fig. 6.13 shows prepared MID microsections. A great deal of work is involved in this method of testing, because embedding and grinding are generally manual or only partly automated at best and only a very small part of the test specimen can be examined, but on the upside even ultra-fine structures can be studied under suitable high-resolution microscopes. Prepared sections can also be subjected to processes from materials analysis, such as energy-dispersive X-ray spectroscopy (EDX), in order to determine the distribution of individual elements in the solder joint. 

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