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Analysis of Integrated Circuits

The authors would like to thank the other members of the Polymer Vision team for their help in realizing the results described. DuPont Teijin Films is thanked for the supply of backplane foils. [Pg.342]

Rogers, Z. Bao, K. Baldwin, A. Dodabaiapur, B. Crone, H.E. Katz, V. Kuck, K. Amundson, P. Drzaic, Proc. Of National Academy of Sciences 2001, 98, 4835-4840. [Pg.342]

Zschies-chang, G. Schmid, W. Radlik, [Pg.342]

Eckert, W.H. Glauert, A. Ullmann, W. Fix, W. Clemens, IEEE Electron Device Letters 2004, 25, 309-401. [Pg.342]

Hubler, U. Hahn, W. Beier, N. Lasch, T. Fischer, IEEE Polytronic Conference 2002, 172-176. [Pg.342]

Ong MC, Zhao XL, Joman PP, Chin JM, Master RN. Lid adhesive failure study for flip-chip packaging. In I5th Int. Symposium on Physical and Failure Analysis of Integrated Circuits 2008. [Pg.343]

See other pages where Analysis of Integrated Circuits is mentioned: [Pg.326]    [Pg.340]    [Pg.64]   


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