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Aluminum nitride silica coated

Developed to provide improved thermal management for today s smaller, faster electronic devices, silica coated aluminum nitride is a highly thermally conductive filler material used in semiconductor molding compounds. Molding compounds filled with this material provide the potential to improve reliability when compared to standard and non-metal-enhanced packages. Silica coated aluminum nitride also provides the potential to enhance functionality, power, heat dissipation and performance, while lowering system costs. [Pg.727]

See other pages where Aluminum nitride silica coated is mentioned: [Pg.727]    [Pg.727]    [Pg.109]    [Pg.604]    [Pg.523]    [Pg.246]    [Pg.242]    [Pg.179]    [Pg.118]   
See also in sourсe #XX -- [ Pg.2 ]



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