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Aluminum nitride production costs

A typical thermally conductive epoxy system used as an adhesive, as well as for other purposes, has a thermal conductivity of 0.0026 cal/cm/sec/°C and a volume resistivity of 1.5 x 10 ohm.cm (1.5 x 10 ohm.m). Fillers include alumina (aluminum oxide), beryllia (beryllium oxide), other unspecified inorganic oxides, boron nitride, and silica. Boron nitride is an excellent choice as a thermally conductive filler except that its content reaches a maximum at about 40% by weight in epoxy resins. The resultant products are always thixotropic pastes. BerylUa powder has excellent thermal conductivity by itself, but when mixed with a resin binder its conductivity drops drastically. It is also highly toxic and high in cost. Alumina is a commonly used filler to impart thermal conductivity in resins. ... [Pg.75]

See other pages where Aluminum nitride production costs is mentioned: [Pg.63]    [Pg.202]    [Pg.277]    [Pg.12]    [Pg.12]    [Pg.432]    [Pg.12]    [Pg.28]   
See also in sourсe #XX -- [ Pg.118 ]

See also in sourсe #XX -- [ Pg.118 ]



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