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Alumina films titania coated

The pore doping approach has also been successful in maintaining small NC size dispersities. Initially, porous dip-coated alumina and titania films were fabricated and then directly immersed into aqueous solutions of NaAuCl4-2H20 so that the AuCLt ions could be incorporated into the pores of... [Pg.5920]

The integration of nanoMOFs onto surfaces has attracted major interest over the last few years, as it enables facile incorporation of MOF properties (e.g., porosity, magnetism, and luminescence) into functional metallic, metal oxide, and organic substrates as well as into porous alumina and titania supports. This method enables production of MOF thin films and membranes (or SURMOFs) with various compositions and controllable parameters (thickness and pore size, functionahties, and orientation). Direct deposition is a straightforward way to form polycrystalline MOF films it involves dip-coating... [Pg.23]

As an alternative, stable high-coverage nonpolar RPC sorbents phases have been prepared by cross-linking hydrophobic polymers at the silica surface, either via free radical 143 or condensation 101 polymerization chemistry. In this case, the underlying silica becomes partly protected from hydrolytic degradation due to the presence of the hydrophobic polymer film coating that effectively shields the support material. Similar procedures have been employed to chemically modify the surface of other support materials, such as porous zirconia, titania, or alumina, to further impart resistance to degradation when alkaline mobile-phase conditions are employed. Porous polystyrene-divinylbenzene sorbents, be-... [Pg.583]

Two methods for the evaporation of precursors may be employed - resistance heating and electron beam collision. The first method employs a simple alumina crucible that is heated by a W filament. Temperatures as high as 1,800°C may be reached inside the chamber, which is enough for some metals or metal salts to vaporize. Deposition rates for this method are 1-20 A s . The use of an electron beam to assist in the precursor evaporation results in temperatures on the order of 3,000°C, being more suited for the deposition of refractory metals/alloys and metal oxides such as alumina, titania, and zirconia. Since the temperature of the chamber interior is much higher than the walls, the gas-phase ions/atoms/molecules condense on the sidewalls as well as the substrate this may lead to film contamination as the nonselective coating flakes off the chamber walls. [Pg.193]

The experimental observation that there exists a critical thickness above which cracking occurs cannot easily be explained. Brinker [1] discusses a theory which explains that very thin layers can bear much larger stresses because critical cracks carmot be formed unless a certain critical thickness is surpassed. This thickness is estimated to be equal to or less than 1 pm and Brinker comes to the conclusion that thicker films will always crack. This is certainly not the case for alumina, titania and zirconia films for which much larger (alumina) to larger (titania) thicknesses are observed. As shown in Table 8.2 critical thicknesses of a few pm in single-step dip-coated films occur and critical flaws are smaller than this thickness and so can be present. [Pg.296]


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See also in sourсe #XX -- [ Pg.16 ]




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