Aging hygro-thermal

Fig. 29.3 PALS analysis of the epoxy thin films on an Au substrate. Both ortho-positro-nium formation probability Ps and average lifetime To-ps are depicted as functions of the average positron implantation depth. The data are from an unaged, a thermally aged, and a hygro-thermally aged epoxy film prepared in an identical way. Solid lines are included in the graphs to stress the implantation depth dependence of To-ps and /g.ps for every data set.

Additionally, both aging mechanisms have less effect on in the volume of the epoxy films on a Cu substrate than on Au and A1 substrates for hygro-thermal aging there is an increase of 15 ps instead of approximately 30 ps, and for thermal aging the decrease is 20 ps instead of approximately 25 ps. 

Fig. 29.7 Depth-resolved XPS results of the analysis of the atomic nitrogen concentrations of a hygro-thermally aged thin epoxy film versus the sputter depth of the adhesive.

Fig. 28.1 Initial spectroscopic degree of oxirane conversion U p for epoxy films on Au, Al, and Cu prepared for hygro-thermo-oxidative aging (preparation 1) and for thermal aging (preparation 2).

Fig. 28.3 Spectroscopic degree of oxirane conversion U p and hydroxyl band intensity /oH,norm foi" (3) 125 nm and (b) 650 nm epoxy films on Au during thermal or hygro-thermo-oxidative aging.

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