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Adhesives, applications high-risk components

Thermally conductive adhesives may be filled with metal, ceramic, or inorganic particles. Silver-filled epoxies have high thermal conductivities, but may not be used where there is a risk of electrical shorting. In such cases, epoxies or other polymers filled with electrically resistive, but thermally conductive materials such as aluminum nitride, boron nitride, alumina, or beryllia must be used. Some applications for thermally conductive adhesives include attachment of power devices, heat sinks, large components such as capacitors and transformers, large ceramic substrates, and edge connectors. [Pg.8]


See other pages where Adhesives, applications high-risk components is mentioned: [Pg.295]    [Pg.358]    [Pg.740]    [Pg.666]    [Pg.983]    [Pg.817]    [Pg.481]    [Pg.110]    [Pg.805]    [Pg.158]   
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