A Model for the Full Adhesive Formulations SIS-SI-Resin

For the full formulations, the resin is considered as an antiplastifying solvent of the isoprene matrix, which is treated as a concentrated polymer solution [24, 25]. 

As previously described, the resin shifts the glass transition temperature of the isoprene part. It is possible to explain/predict the shift from the master curves of the pure [SIS-SI] by calculating the modified elementary times Tq and ToHF through Eqs. (16, 17), taking into account the change in the mobility factor (friction coefficient) [5, 25] and considering an increase in the Vogel temperature (Too) of the WLF (Williams, Landel and Ferry [16]) equation. 

It is important to point out that we have demonstrated that the two copolymers in the study, [SI] and [SIS], have, as a first approximation, the same characteris- 

We noticed previously that, when resins are added to the copolymer blend, the plateau modulus decreases (which is what we call a dilution effecf, as opposed to the thermodynamic effecf on the Tg described above). The entanglement network of the isoprene part of the copolymers is swollen and the molecular weight between two entanglement points increases by following the relevant power law [Eq. (19)], where the experimental values of n may range from 2 (theoretical value) to 2.5 for concentrated polymer solutions and melts as well as for the copolymers in the present study [4, 5, 20, 24, 25]. This topological effect is the same as for the isoprene part of diblock and triblock copolymers. 

One can verify (Fig. 16.3) the good agreement between experimental data and calculations for [SIS-SI-resin] full adhesive formulations. 

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