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Water immersion ArF

Water immersion ArF lithography was deployed for the first time in large-scale fabrication of critical layers of IC devices at the 45-nm technology node in 2008,... [Pg.692]

Figure 13.51 Schematic showing the main physical and optical differences of water immersion and dry ArF lithographies. Figure 13.51 Schematic showing the main physical and optical differences of water immersion and dry ArF lithographies.
See other pages where Water immersion ArF is mentioned: [Pg.164]    [Pg.692]    [Pg.700]    [Pg.164]    [Pg.692]    [Pg.700]    [Pg.665]    [Pg.695]    [Pg.576]    [Pg.234]    [Pg.103]    [Pg.104]    [Pg.176]   


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ARFs

Immersed

Immersion

Water immersion

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