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Wafer bonding Microelectromechanical systems

Niklaus F. Adhesive wafer bonding for microelectronic and microelectromechanical systems. Ph.D. Thesis, Royal Institute of Technology (KTH), Stockholm, Sweden. [Pg.462]

Wang Q, Choa SH, Kim WB, Hwang IS, Ham SJ, Moon CY (2006) Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging. J Electron Mater 35(3) 425 32... [Pg.492]

See other pages where Wafer bonding Microelectromechanical systems is mentioned: [Pg.2232] [Pg.3476] [Pg.1360] [Pg.2180] [Pg.50] [Pg.389] [Pg.183]

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Bond Systems

Bonded Systems

Bonding system

Microelectromechanical

Microelectromechanics

Wafer bonding

Wafers