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Underpotential deposition of copper

Figure 14. VoUammetric scans for the underpotential deposition of copper on (A) an epitaxial film of gold (111 orientation) on mica, and on (B) a bulk Pt(l 11) single-crystal electrode coated with a layer of iodine. Experimental conditions (A) 1M H2SO4 containing 5 X 10 MCu , sweep rate 1 mV/sec. (B) 0.1 M HjSO containing 5 x 10 M Cu sweep rate 1 mV/sec. (From Abruna, H. D., White, J. H., et al., J. Phys. Chem. 92, 7045 (1988), with permission.)... Figure 14. VoUammetric scans for the underpotential deposition of copper on (A) an epitaxial film of gold (111 orientation) on mica, and on (B) a bulk Pt(l 11) single-crystal electrode coated with a layer of iodine. Experimental conditions (A) 1M H2SO4 containing 5 X 10 MCu , sweep rate 1 mV/sec. (B) 0.1 M HjSO containing 5 x 10 M Cu sweep rate 1 mV/sec. (From Abruna, H. D., White, J. H., et al., J. Phys. Chem. 92, 7045 (1988), with permission.)...
Nishihara C and Nozoye H 1995 Influence of underpotential deposition of copper with submonolayer coverage on hydrogen adsorption at the stepped surfaces Pt(955), Pt(322) and Pt(544) in sulfuric acid solution J. Electroanal. Chem. 396139-42... [Pg.2756]

Inukai J, Osawa Y, Wakisaka M, Sashikata K, Kim Y-G and Itaya K 1998 Underpotential deposition of copper on iodine-modified Pt(111) In situ STM and ex situ LEED studies J.Phys. Chem. 102 3498-505... [Pg.2757]

Flachiya T, Flonobo T and Itaya K 1991 Detailed underpotential deposition of copper on gold (111) in aqueous solutions J. Eiectroanai. Chem. 315 275-91... [Pg.2757]

Tidswell I M, Lucas C A, Markovic N M and Ross P N 1995 Surface structure determination using anomalous x-ray scattering Underpotential deposition of copper on Pt(111) Phys. Rev. B 51 10 205-8... [Pg.2757]

Second harmonic generation has also been used to study the semiconductor/ solution interface during the deposition of gold on Si(lll) [777]. In a setup combining SHG and the electrochemical quartz crystal microbalance (EQCM), the underpotential deposition of copper on a polycrystalline gold surface has been studied a decrease of the SHG signal by 60% upon formation of the upd-layer was found [778]. A study of the electrochemical liquid/liquid interface between two immiscible solutions where adsorption of surfactants occurred has been reported [779]. [Pg.175]

Chierchie T, Mayer C (1988) Voltammetiic study of the underpotential deposition of copper on polycrystalline and single crystal palladium surfaces. Electrochim Acta 33(3) 341-345... [Pg.530]

Green CL, Kucemak A (2002) Determination of the platinum and ruthenium surface areas in platinum-ruthenium alloy electrocatalysts by underpotential deposition of copper. 1. Unsupported catalysts. J Phys Chem B 106 1036-1047... [Pg.680]

The Effects of Bromide Adsorption on the Underpotential Deposition of Copper at the Pt(lll)—Solution Interface... [Pg.87]

Electrochemical Active Surface Area (ESCA) of Pt-based catalysts through the hydrogen adsorption/desorption peak area, CO stripping, and underpotential deposition of copper (Cu-UPD) methods. [Pg.232]

Sashikata, K. Fumy a, N. Itaya, K. 1991. In situ scanning tunneling microscopy of underpotential deposition of copper on platiunum( 111) in sufluric acid solutions. J. Electroanal. Chem. 316 361-368. [Pg.743]

S. Szabo, 3. 8akos, F. Nagy and T. Malldt, Study of the underpotential deposition of copper, onto polycrystalline palladium surfaces, 3. Electroanal. Chem., 263 (1989) 137-146. [Pg.468]

See other pages where Underpotential deposition of copper is mentioned: [Pg.324]    [Pg.182]    [Pg.50]    [Pg.50]    [Pg.285]    [Pg.2751]    [Pg.2756]    [Pg.418]    [Pg.425]    [Pg.162]    [Pg.406]    [Pg.413]    [Pg.1177]    [Pg.171]    [Pg.235]    [Pg.468]   
See also in sourсe #XX -- [ Pg.235 ]



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