Underfill adhesives stresses

After attaching the BGA packages to a PWB and reflowing the solder, an underfill adhesive similar to that used for flip chips may be dispensed and allowed to fill the spaces between the solder balls, thus reinforcing the connections and relieving stress in the entire structure. 

When the shear stress of a liquid is directly proportional to the strain rate, as in Fig. 2.4a, the liquid is said to exhibit ideal viscous flow or Newtonian behavior. Most unfilled and capillary underfill adhesives are Newtonian fluids. Materials whose viscosity decreases with increasing shear rate are said to display non-Newtonian behavior or shear thinning (Fig. 2.4b). Non-Newtonian fluids are also referred to as pseudoplastic or thixotropic. For these materials, the shear rate increases faster than the shear stress. Most fllled adhesives that can be screen printed or automatically dispensed for surface-mounting components are thixotropic and non-Newtonian. A second deviation from Newtonian behavior is shear thickening in which viscosity increases with increasing shear rate. This type of non-Newtonian behavior, however, rarely occurs with polymers. ... 

Some adhesive materials and processes are used across many apphcations. For example, adhesives are used to attach bare die, components, and substrates in assembling commercial, consumer and aerospace electronic products. Adhesives are also widely used for surface mounting components onto interconnect substrates that serve numerous functions for both low-end consumer products and for high rehability applications. Underfill adhesives are used to provide stress relief and ruggedize the solder interconnects for almost all flip-chip and area-array devices, regardless of their function as integrated circuits. 

Several approaches using electrically conductive adhesives instead of solder have been explored and are proving successful. Anisotropic adhesives (See Chapter 1), for example, have been used to connect flex circuits and cables from the separate driver circuits to the panel, avoiding the use of solder connections. More importantly, integrated-circuit chips can be bonded directly to the ITO conductor traces on the panel, a technology called chip-on-glass (COG). IC chips can be flip-chip bonded, then underfilled with a stress-free underfill adhesive if necessary. For protection, the chips may then be encapsulated with epoxy (glob-topped). 

The absorption of moisture in underfill adhesives induces a tensile hygrothermal stress on the solder-ball connections causing electrical opens in the connections and cracking in the adhesive. These tensile stresses offset the compressive stresses that underfill adhesives provide in improving the reliability of flip-chip and ball-grid-array devices. 

Underfill for flip-chip-attached devices. With the availability and increased use of flip-chip devices, a need has arisen to reinforce the connections and dissipate stresses resulting from mismatches in expansion coefficients among the solder, the substrate, and the device. This need has been met by underfilling the space between the solder connections with specially formulated underfill adhesives (Fig. 1.5). Underfill adhesives are... 

Lastly, adhesives are used to dissipate stresses that may be generated from thermal excursions, mechanical shock, vibration, or moisture. Specially formulated adhesives are effectively used as underfills for flip-chip devices and ball-grid-array packages to compensate for mismatches of expansion coefficients among the solder, the silicon chip, and the ceramic or plastic-laminate substrate. Low-stress adhesives are also used to attach fragile devices such glass diodes and to dampen stresses due to vibration. 

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