Unbaked and baked films

Table III. Planarization Achieved by Unbaked and Baked Films...

Table IV lists the planarization of 20 - 400 [im wide holes achieved by unbaked and baked films of positive photoresist, ortho-cresol novolac and poly(o>-methylstyrene).

We are also interested in understanding the effect of thermal treatment on dissolution behavior of embedded films as a means to study the mobflity of the PAC. Therefore, one set of dissolution experiments was performed on films that were unbaked and one set on embedded films that were baked at 90°C for 60 minutes in a convection oven. 

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