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Ultrasonic lapping removal mechanisms

There are different removal mechanisms listed for ultrasonic lapping in literature that rate the various identified mechanisms partially according to... [Pg.332]

Figure 17.5 presents the predominant mechanisms of material removal during ultrasonic lapping. [Pg.334]

Recent investigations (Hilleke, 1998) confirm the statement that direct and indirect impacts as well as grain spinning-on onto the workpiece surface represent the predominant mechanisms of material removal during ultrasonic lapping. The contribution of cavitation phenomena is considered to be trivial (Rozenberg et al., 1964). [Pg.334]

See other pages where Ultrasonic lapping removal mechanisms is mentioned: [Pg.328]    [Pg.332]    [Pg.332]    [Pg.340]    [Pg.367]    [Pg.191]    [Pg.382]   
See also in sourсe #XX -- [ Pg.332 , Pg.333 ]



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