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Thermomechanical reliability prediction

Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects... [Pg.181]

N. Nemeth. O. Jadaan, and J.P. Gydcenyesi. Lifetime Reliability Prediction of Ceramic Structures Under Transient Thermomechanical Loads, NASA TP-2005-212505 (2005). [Pg.172]

Up-front thermomechanical modeling and physics-based reliability prediction of lead-free solder joints could save significant amount of cost and time in microsystem product develop-... [Pg.194]

See other pages where Thermomechanical reliability prediction is mentioned: [Pg.196]    [Pg.379]    [Pg.211]    [Pg.236]    [Pg.382]    [Pg.108]    [Pg.466]    [Pg.14]    [Pg.648]   
See also in sourсe #XX -- [ Pg.181 , Pg.198 ]



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