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Thermal ratcheting, anisotropy

Unlike lead, tin exhibits anisotropy, e.g., coefficient of thermal expansion that varies by a factor of 2 in different crystallographic directions. As discussed in Sec. III.C, this condition can lead to large internal stresses and thermal ratcheting in tin alloys that does not occur in lead-based solders. These effects are anticipated during normal thermal and power cycling tests with no... [Pg.971]

See other pages where Thermal ratcheting, anisotropy is mentioned: [Pg.924]    [Pg.925]    [Pg.926]    [Pg.926]    [Pg.934]    [Pg.964]    [Pg.973]    [Pg.358]   
See also in sourсe #XX -- [ Pg.926 , Pg.927 , Pg.928 ]



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Anisotropy, thermal

Ratcheting

Ratchets

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