Thermal isolation, laminator

Flexible copper-clad laminates with nonthermoplastic polyimides were prepared in a two-step process entailing isolating the polyamic acid and then thermally imidizing to the corresponding polyimide. Plasma or thermal treatments of selected polyimides generated materials with excellent bonding strength when evaluated on laminated copper foil. 

Strain. Since the thermal strain in these plies is tensile, the first ply cracking of the laminate is less than that of an isolated 90° ply. 

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