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Thermal degradation modeling scission process

Notwithstanding this complexity, some semiempirical rules could be identified by analogy with small organic model molecules, and by considering that thermal degradation is a homolytic bond scission process initiated by thermally activated molecular vibrations ... [Pg.779]

In a recent version of the Tobolsky and Eyring formulation, the rate of mechanochemical degradation was considered as a Thermally Activated Barrier to Scission (TABS) process. The elastic energy function f(v /) was explicitly considered in terms of the frictional hydrodynamic drag force acting over the entire macromolecule [100]. A more detailed account of this model will be presented in Sect. 5.1. [Pg.112]

Fig. 3.30). Mass loss may be categorized as volatile components such as absorbed moisture, residual solvents, or low-molecular-mass additives or oligomers that generally evaporate between ambient and 300 °C reaction products, such as water and formaldehyde from the cure of phenolic and amino resins, which generally form between 100 °C and 250 °C and generation of volatile degradation products resulting from chain scission that generally require temperatures above 200 °C but not more than 800 °C. All of these mass loss processes may be characterized by TGA to yield information such as composition, extent of cure, and thermal stability. The kinetics of these processes may also be determined to model and predict cure, thermal stability, and aging due to thermal and thermooxidative processes. Fig. 3.30). Mass loss may be categorized as volatile components such as absorbed moisture, residual solvents, or low-molecular-mass additives or oligomers that generally evaporate between ambient and 300 °C reaction products, such as water and formaldehyde from the cure of phenolic and amino resins, which generally form between 100 °C and 250 °C and generation of volatile degradation products resulting from chain scission that generally require temperatures above 200 °C but not more than 800 °C. All of these mass loss processes may be characterized by TGA to yield information such as composition, extent of cure, and thermal stability. The kinetics of these processes may also be determined to model and predict cure, thermal stability, and aging due to thermal and thermooxidative processes.

See other pages where Thermal degradation modeling scission process is mentioned: [Pg.164]    [Pg.1890]    [Pg.24]    [Pg.433]    [Pg.37]    [Pg.94]    [Pg.195]    [Pg.244]    [Pg.245]    [Pg.81]    [Pg.310]    [Pg.138]    [Pg.166]    [Pg.190]   
See also in sourсe #XX -- [ Pg.482 ]




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