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The A Leak Methodology

3 The O2 Leak Methodology As covered in Section 4.2.1.1, SIMS requires a vacuum of better than 1 X 10 Torr (that at which the mean free path of an ion equates to 1 m, which equates to the typical path length of a primary or secondary ion column). More typically, a vacuum of better than 1 x 10 Torr is used to control the adsorption of gas phase molecules. As an example, a monolayer of Oxygen will form on Silicon in Is when in the 10 Torr range. [Pg.233]

Such analysis should, however, be carried out with extreme care, because  [Pg.234]

Not only does the secondary ion yield vary with the O2 leak pressure used, but so too does the sputter rate (a decrease in sputter rates is commonly observed) [Pg.234]

Higher chamber pressures will result in increased neutralization of the primary ion beam. This, in turn, can result in a loss of depth resolution (as is discussed in Section 5.3.2.4, this will occur if the neutral population were to strike an area away from that of the primary ion beam) [Pg.234]

The adsorption of Oxygen onto the internal surfaces of the analysis chamber that also occurs during the implementation of O2 leak conditions will require extended pump-down times if UHV conditions are required in subsequent analysis. Such analysis should, therefore, be carefully planned in accordance with any other analysis required. [Pg.234]




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