Synthesis and Characterization of SILP Materials

The API-ILs studied here are noncovalendy supported on the silica carrier forming easily handled solids with improved thermal stabihty when compared to the neat compounds (Table 19.2). The decomposition temperatures were determined by TGA and are reported as (decomposition temperature) or T5%onset onset temperature for 5% decomposition) [17a]. For example, the 10 wt% [P4444][Ibu] adsorbed on SiO2-90 has a of 386°C, which is 150 °C higher than that 

2 Release Studies oftheAPI-ILs from the SILP Materials 

The effect of adsorption loading procedures described earlier (adsorption from solution and IWI) was also investigated. A fast and complete release of the supported IL was obtained when the adsorption from solution loading was used. 

Depending on the nature of the dissolution medium used for the release studies, different leaching behaviors are obtained. The release rates of both [P4444][Ibu] and [lid][Ibu] at 20 wt% loading in PBS (pH 7.4), SIF (pH 6.8), and SGF (pH 1.2) 

A different behavior was observed for the dual active API-IL [Lid][Ibu]. The same fast and full release was obtained in PBS, but a slower and incomplete leaching was observed when the acidity of the dissolution medium increased (SIF and 

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