Subject overpotential deposition

Stress reflects all the complexity of influences of various factors on formation of metal plates by electrodeposition and has, therefore, been the subject of extensive studies they cover effects of substrate, plating solution composition, pH, deposit thickness, current density, or overpotential, deposition temperature. Detailed reviews are available. " ... 

Fig. 1.15 Polarization curve for the potentiostatic deposition of copper from 0.20 M CUSO4 in 0.50 M H2SO4 and the cross sections of copper deposits obtained on copper wire electrodes previously plated with nickel (a) overpotential 200 mV, deposition time 6 h (b) overpotential 300 mV, deposition time 5 h, and (c) overpotential 700 mV, deposition time 2 min (Reprinted from [24, 29, 40] with permission from Springer and copied by permission frran the Electrochemistry Encyclopedia (http //electrochem.cwru.edu/ed/encycl/) on 04/25/2007. The original material is subject to periodical changes and updates.)...

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