Storage compliance illustrations

Tan 5, storage compliance, and loss compliance values for these experiments are plotted as a function of time in Figure 8. This transient temperature cycle data illustrates interactions between the dynamic mechanical plasticization and blocking behavior just discussed as well as the epoxy s equilibrium moisture uptake behavior (3), and the temperature behavior of dynamic mechanical properties observed for this epoxy in Figure 2a. Perhaps the easiest comparison to consider involves the relationship between transient temperature cycling data of Figure 8 and the thermal behavior observed for N-5208 epoxy tan 6 data of Figure 2a. 

Storage compliance of poly (n-octyl methacrylate) in the transition zone between glasslike and rubberlike consistency plotted logarithmically against frequency at 24 temperatures as indicated. The shifting of one data point from 80 to 100°C, the reference temperature, using eq. 11.6.2 is illustrated. Adopted from Ferry (1980). 

Figure 5.11. Illustration of modulus versus time for a creep or stress relaxation experiment on a typical amorphous polymer (T = constant). Note the similarity to the plot of DMA storage modulus versus temperature. The reciprocal of creep compliance, l//(f), would be used to generate the modulus curve derived from the creep response.

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