STI and Silicon Oxide CMP

Si02 slurries are quite easy to remove and do not produce any brush-loading effect since the commercial slurry used does not contain too many foreign particles. The simplest scrubber process consists in a 

On a wet bench, a conventional SCI with megasonics to remove the particles followed by an HF dip to remove both the damaged layer and metallic contamination gives satisfactory results. 

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