Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Solder materials residue removal

Chlorine, sulfur and zinc are potentially harmful chemical elements. Paints and crayons used to mark susceptible alloys must contain low quantities (measured in parts per million, or ppm) of the harmful chemical elements. Less than 100 ppm is allowable. Even if approved marking materials are used, they should be removed from areas that are to be welded, brazed or soldered. An approved solvent such as a non-chlorinat-ed type should be used to remove marking materials. The same principles apply when adhesive-backed tapes are used to fix items to stainless and nickel alloy products (e.g., for radiography). All traces of adhesive must be removed from the surface with an approved solvent. There are no restrictions on using fiber tip markers because they do not leave solid residue. Solvent removal is not required with fiber tip markers. [Pg.140]


See other pages where Solder materials residue removal is mentioned: [Pg.2780]    [Pg.1013]    [Pg.651]    [Pg.833]    [Pg.310]    [Pg.1215]    [Pg.264]    [Pg.196]    [Pg.29]    [Pg.210]    [Pg.240]    [Pg.253]    [Pg.759]    [Pg.253]    [Pg.918]    [Pg.927]    [Pg.961]    [Pg.966]    [Pg.1190]    [Pg.272]    [Pg.129]    [Pg.5]    [Pg.405]    [Pg.414]    [Pg.531]    [Pg.569]    [Pg.153]   
See also in sourсe #XX -- [ Pg.14 ]




SEARCH



Residual removal

Residues removing

Soldering materials

© 2024 chempedia.info