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Solder joint reliability Thermomechanical

In addition, this chapter outlines the role of numerical analysis techniques in anatyzing and improving the reliability of solder joint interconnects. Detailed procedures illustrating the use of finite element analysis (FEA) in estimating the thermomechanical fatigue Ufe of solder joint interconnects and monotonic bend testing are also discussed. [Pg.1399]

Bieler.T. R., Jiang, H., Lehman, L. R,Kirkpatrick,T., Cotts,E. J., Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints, Electronic Components and Technology Conference, 2006, pp. 1462-1467. [Pg.1433]

Up-front thermomechanical modeling and physics-based reliability prediction of lead-free solder joints could save significant amount of cost and time in microsystem product develop-... [Pg.194]

See other pages where Solder joint reliability Thermomechanical is mentioned: [Pg.17]    [Pg.1371]    [Pg.1375]    [Pg.1399]    [Pg.1400]    [Pg.16]    [Pg.175]    [Pg.236]    [Pg.240]    [Pg.309]    [Pg.490]    [Pg.790]    [Pg.93]    [Pg.233]    [Pg.648]   
See also in sourсe #XX -- [ Pg.20 , Pg.59 ]



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