Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Solder fatigue, microstructural effects

Thermomechanical fatigue of solders may be further complicated because the compositions and volume fractions of the phases present vary with temperature. In contrast to Sn-Pb solders, this is likely to only be a minor problem with Sn-Ag eutectic solder because the solubility of silver in solid tin is very small at all temperatures. This is also true for Sn-Cu-based solders. With Sn-Zn-based solders, the effect of temperature on the microstructure is minimal because the maximum solubility of Zn in Sn is only 0.6 at.% at the eutectic temperature. Although the phase... [Pg.235]

See other pages where Solder fatigue, microstructural effects is mentioned: [Pg.84]    [Pg.208]    [Pg.48]    [Pg.69]    [Pg.85]    [Pg.103]    [Pg.224]    [Pg.225]    [Pg.226]    [Pg.236]    [Pg.309]    [Pg.792]    [Pg.795]    [Pg.1017]    [Pg.185]   
See also in sourсe #XX -- [ Pg.200 , Pg.201 ]



SEARCH



Fatigue effects

Microstructural effect

Microstructure effects

Microstructure fatigue

Solder microstructures

© 2024 chempedia.info