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Small-scale creep behavior

The ASTM method for creep testing is provided in Ref 53. Any one of the test methods described in Ref 4 to 7 can also be adapted for creep testing. Novel test procedures can be used to assess the creep behavior of soldered joints. Although time-dependent deformation is, in general, less sensitive to joint geometry that is the faster stress-strain test, it is not completely immune to the effects of joint dimensions, as well as possible size or length-scale effects that may occur for very small interconnections (e.g., flip chip joints). [Pg.88]

M. Kerr and N. Chawla, Creep Deformation Behavior of Sn-3.5Ag Solder/Cu Couple at Small Length Scales, Acta Mater., 2004, in press... [Pg.106]

See other pages where Small-scale creep behavior is mentioned: [Pg.335]    [Pg.336]    [Pg.336]    [Pg.514]    [Pg.977]    [Pg.196]    [Pg.192]    [Pg.115]    [Pg.192]    [Pg.295]    [Pg.86]    [Pg.55]    [Pg.168]    [Pg.642]    [Pg.413]    [Pg.73]    [Pg.356]    [Pg.34]    [Pg.113]   


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Creep behavior

Small-scale

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