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Si Slicing and Layer Transfer Ion-Cut

The Ion-Cut process is an innovative approach for engineering materials. It provides an effective, versatile, and economical method of transferring thin surface layers from bulk substrates onto a host of other substrates and thus offers a novel method to achieve multimaterial integration. [Pg.143]

See other pages where Si Slicing and Layer Transfer Ion-Cut is mentioned: [Pg.143] [Pg.144] [Pg.146] [Pg.148] [Pg.150] [Pg.152] [Pg.154] [Pg.156] [Pg.158] [Pg.143] [Pg.144] [Pg.146] [Pg.150] [Pg.152] [Pg.154] [Pg.158] [Pg.143] [Pg.144] [Pg.146] [Pg.148] [Pg.150] [Pg.152] [Pg.154] [Pg.156] [Pg.158] [Pg.143] [Pg.144] [Pg.146] [Pg.150] [Pg.152] [Pg.154] [Pg.158]

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Ion transfer

Ion transference

Layer transfer

Slice

Slicing