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Sequential electrochemical reduction analysis

Solder spread or ability to wet determines the shape of a fillet in a solder joint. Sattiraju et al. investigated the solderability of immersion tin, ENIG, electroless palladium, and OSP surface finishes with Sn-3.4Ag-4.8Bi, Sn-4.0Ag-0.5Cu, Sn-3.5Ag, and Sn-0.7Cu lead-free interconnection alloys both in air and nitrogen using sequential electrochemical reduction analysis (SERA) and wetting balance techniques. It has been reported that Ni/Au finish performed the best and OSP performed the worst in both nitrogen atmosphere and air environment, suggesting a preference for Ni/Au finish. The Sn-0.7Cu alloy was considered superior, whereas Sn-4.0Ag-... [Pg.803]

See other pages where Sequential electrochemical reduction analysis is mentioned: [Pg.98]    [Pg.331]    [Pg.137]    [Pg.69]    [Pg.239]    [Pg.255]    [Pg.86]    [Pg.251]    [Pg.74]    [Pg.84]   
See also in sourсe #XX -- [ Pg.803 ]



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