Results of Model Calculations for the Cu-Ni System

We apply now the model approach to the Cu/Ni/Cu system with a thickness of the A film of several micrometers at a temperature 888 K. The DIGM in such system for the case of the bulk sample was investigated in [47-49, 51]. We suppose that in such a thin film system it is possible to investigate the movement of the flat grain boundary by DIGM mechanism without the influence the boundary curvature. 

Tc(cb), P and/(r) were described in [51]. Using the polynomial fitting of second order and the method of least-squares, we determine the curvature 

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