PVD—See Physical vapor deposition

CVD [Chemical Vapor Deposition] A general term for any process for depositing a solid on a solid surface by a chemical reaction from reactants in the gas phase. To be distinguished from Physical Vapor Deposition (PVD), in which no chemical reaction takes place. (For the ten international conferences held on this between 1967 and 1987 see the reference by Stinton et al. below.)... 

It appears in this discussion that electrochemical parameters and not substrate properties are the main deciding factors in determining the texture of deposits. This is indeed so when a deposit s thickness is 1 pum or more. In case of thinner deposits, the substrate plays an important role as well (see the text above). Another nonelectrochem-ical factor may be the codeposition of particulate matter with some metal deposits. To summarize, we note that texture is influenced mostly by deposition current density, as it is itself a function of bath pH, potential, and other parameters. Not surprising, then, is the fact that in the case of physical vapor deposition (PVD), the deposition rate is the determining factor in setting the texture of the coating. 

Physical Vapor Deposition Processes. The three physical vapor deposition (PVD) processes are evaporation, ion plating, and sputtering (see Thin films, film formation techniques). 

Physical Vapor Deposition (PVD) includes various methods for depositing thin films onto a substrate by the condensation of a desired vapor. For this process the coating material changes from the solid phase to the vapor phase and back to the solid phase (as it builds a film on the substrate). See Fig. 3 [12]. 

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