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Post-Oxide CMP Cleaning

4 POST-CMP CLEANING ACCORDING TO APPLICATIONS 16.4.1 Post-Oxide CMP Cleaning [Pg.480]

In oxide CMP process, colloidal or fumed silica slurries with high pH values are often used. After the polishing, the wafer must be washed effectively to [Pg.480]

See other pages where Post-Oxide CMP Cleaning is mentioned: [Pg.518]    [Pg.168]   
See also in sourсe #XX -- [ Pg.480 ]



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Post-CMP cleaning

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