Polishing vs. Grinding

To understand the level at which material is abraded during CMP, it is instructive to compare polishing to grinding. The main difference between grinding and polishing is the abrasive size. Grinding normally employs abrasives on the order of 1-100 pm in diameter, whereas polishing normally employs abrasive on the 

Abrasion Mode Mass Removed via Scale of Mass Removal 

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