Ion plating plasma-based

In plasma-based ion plating, the negative potential on the substrate surface can be generated by applying either a continuous d-c potential to an... 

Two basic versions of the process plasma-based ion plating and vacuum-based ion plating. The coating material is vaporized in a manner similar to evaporation. Typically, the plasma is obtained by biasing the substrate to a high negative potential (5 kV) at low pressure. The constant ion bombardment of the substrate sputters off some of the surface atoms which results in improved adhesion and reduced impurities. Surface coverage of discontinuities is also improved. 

In ion-plating deposition, the substrate and the deposited film (as it forms) are subjected to bombardment by particles (ions, atoms, molecules) which alter the formation process and the properties of the coating.l ll l The process is also called ion-beam assisted deposition (IBAD). Two basic versions of the process, plasma-based ion plating and vacuum-based ion plating, are illustrated in Figs. 15.8 and 15.9. 

Figure 9.1 Ion Plating Configurations (a) Plasma-Based Ion Plating and (b) Vacuum-based Ion Plating...

In plasma-based ion plating, ions are extracted from a plasma and accelerated to the substrate surface under an applied or self-bias potential. The flux and energy of ions from the plasma will depend on the plasma density and the electric field configuration. Plasma density and plasma properties were discussed in Sec. 5.2.2. 

Plasma-based ion plating Ion plating where the substrate is in contact with a plasma. Typically, ions are extracted from the plasma to bombard the substrate and growing film. 

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