PC Speedup by reduced memory latency

Bench- mark L2 Cache Miss Rate IPC (Baseline 2-D processor) IPC (3-D Processor Tm= 300) Speedup relative to Baseline Processor IPC (3-D Processor Tm = 200) Speedup relative to Baseline Processor 

Institute of Microelectronics, Tsinghua University Beijing 100084, P. R. China, dengyd tsinghua.edu.cn 

Electrical and Computer Engineering Carnegie Mellon University 5000 Forbes Avenue, Pittsburgh, PA 15213-3891 USA, maly ece.cmu.edu 

Keywords 2.5-D integration, floorplanning, placement, routing, layout. 

In the previous chapter, we introduced our design case studies with system partition performed by hand. In fact, the 4 designs we discussed are special cases in the sense that they possess either a regular structure or a clearly defined interface between 

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