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Multilevel alumina

Stein, D., Hetherington, D., Cecchi, J. (1998). Tungsten CMP performance of Politex and IC1400 pads using an iodate/alumina based slurry. Proc. 3rd Int. CMP for ULSI Multilevel Interconnect. Conf, Santa Clara, pp. 161-164. [Pg.181]

JindaL S. Hegde, S.V. Babu, Evaluation of alumina/silica mixed abrasive slurries for chemical-mechanical pohshing of copper and tantalum, in Proceedings of the 18th Inti VLSI Multilevel Interconnection Conference, 2001, p. 297. [Pg.324]

See other pages where Multilevel alumina is mentioned: [Pg.242]    [Pg.246]    [Pg.242]    [Pg.246]    [Pg.178]    [Pg.27]    [Pg.243]    [Pg.244]    [Pg.244]    [Pg.245]    [Pg.288]   
See also in sourсe #XX -- [ Pg.233 , Pg.242 , Pg.243 , Pg.246 ]



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